Microwave Capacitors

SLC-01Teknis Ceramic Products is a world-class supplier of advanced thin film components, including capacitors, resistors, thin film substrates (alumina, AlN, BeO), attenuators, shorts, and other custom thin film products.


Teknis Ceramic Products capacitors are manufactured in a single layer configuration (SLC), surface mount SLC, multi-pad SLC, and SLC arrays. Teknis General Purpose (GP) Capacitors are available in standard sizes ranging from 0.010” to 0.090” square, and thickness of 0.005” to 0.015”. Custom products are available upon request. These capacitors are designed for use at frequencies ranging from 100 MHz to 40 GHz, and are available in values that range from 0.05 to 10,000 pF. Substrate dielectric constants range from 10 to 30K @ 1MHz, and voltage ratings up to 100 VDC can be achieved.

GPC’s can be provided with complete metallization to the edge, or with a gap to minimize shorting during the assembly operation. Standard metal finish is gold over nickel and other custom finishes can be provided upon request.

SS-05Surface Mount SLC’s are designed for conductive epoxy attachment in microwave integrated circuit assemblies where wire bonding is not available or desired. Typical applications include:

  • DC blocks
  • RF Bypass





SA-05SLC Arrays allow for simplified assembly of GaAs MMIC devices which require multiple capacitors of the same value. They can reduce
the length of wire bonds thereby improving the overall performance of the packaged chip. Standard sizes range from 0.015” X 0.065” to
0.040” X 0.125”, depending on the value.





SP-05Multi-Pad SLC’s are used where a series of capacitors in a small space is desired. These are ideal for:

  • Matching Networks
  • Tank Circuits
  • Dielectric Resonator Tuning and Coupling

Standard sizes range from 0.015” square to 0.050” square and they are available with standard metal finishes suitable for soldering or wire bonding.



Please contact Elecsys for additional information on this new adhesive or any of the hundreds of additional materials used for die attach, fiber optic and encapsulation applications.